The advanced packaging market reached $55 billion in 2025 and is expected to increase to more than $120 billion by 2031, says ...

SHENZHEN, GUANGDONG, CHINA, June 22, 2026 /EINPresswire.com/ -- In a rapidly evolving semiconductor landscape, GNS ...

Cadence believes the next level of AI-assisted engineering resides at the system level, and to that end, the company just ...

MOUNTAIN VIEW, Calif.--(BUSINESS WIRE)--Diamond Quanta today announced Adamantine Thermal™, an engineered-diamond thermal platform designed for integration into advanced packaging workflows and ...

WHILE much has been said about advanced packaging in the context of Malaysia’s semiconductor sector, little is actually known about what it entails. The rhetoric is that, since Malaysia has a strong ...

The U.S. Department of Commerce today announced the launch of a new federal funding competition that aims to spur the research and development of more advanced computer chip packaging technologies.

Sixteen miles north of Albuquerque, in Rio Rancho, New Mexico, an Intel chip plant sits on more than 200 acres of land. The site was established in the 1980s, part of it built on top of a sod farm. In ...

Advanced semiconductor packaging is revolutionizing the electronics industry, becoming pivotal as transistor scaling yields diminish. This shift is substantially driven by AI's demand for increased ...

Chiplets have generated a lot of interest in recent years as design engineers look for alternatives to traditional system-on-chip technology to house complex, multi-function electronics. At the ...

Advanced packaging is no longer operating behind the scenes. The technology of advanced packaging is helping to sustain the speed of the semiconductor industry’s improvement in power and performance, ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...