Applied Materials, Inc. provides manufacturing equipment ... The Semiconductor Systems segment includes semiconductor capital equipment for etch, rapid thermal processing, deposition, chemical ...

Both capacitively (RIE) and inductively (ICP) coupled plasma etcher with fluorine-based gases (CF4, CHF3, C4F8, SF6), BCl3, nitrogen, argon, and oxygen for anisotropic dry etching of Si-based ...

The etching and characterization room contains a suite of tools for dry etching and characterization of samples. This includes three dry etchers with a range of capabilities, while characterization ...

(Image: A*STAR Institute of Materials Research and Engineering) Wet etching can be classified into two main types based on the etching mechanism and the resulting profile: It's worth noting that wet ...