A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.

To get its engineers thinking about design for assembly back in the 1980s, Westinghouse made a video about a product optimized for assembly: the IBM Proprinter. The technology may be dated, but the ...

[Will Cogley] makes eyeballs; hey, everyone needs a hobby, and we don’t judge. Like all his animatronics, his eyeballs are wondrous mechanisms, but they do tend toward being a bit complex, especially ...

Designing custom assemblies is essential to advancing bioprocessing, yet teams often face slow design cycles, limited flexibility and communication gaps between users and suppliers. These challenges ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

The chiplet model has been proven by the early adopters. Large companies that successfully developed chips at leading nodes have integrated multiple chiplets into systems, where the entire silicon ...