Having just received a shiny set of PCBs from the fab-house [Devbisme] needed a way to solder the main chip in place. It has a Ball-Grid Array footprint which is notoriously difficult to populate in a ...

If you’re developing a performant IP-KVM based on the Raspberry Pi, an HDMI capture device that plugs into the board’s CSI port would certainly be pretty high on your list of dream peripherals. Turns ...

– adapted to various socket locking systems: Twist lock, Knob lock, ZIF lock, Quicklock sockets – low profile solution: the adapter mounted together with the E-tec twist lock socket will only have a ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

Can unleaded BGA solder balls potentially grow tin whiskers as tin plated leads do? Annealing seems to be the standard approach for pure tin plated lead devices, but what about BGAs? Are unleaded BGA ...

Shenmao Technology has expanded its production capacity of ball-grid array (BGA) solder spheres, its main product line, by 70% to meet orders from new clients, according to the company. Save my User ...

X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...

Material supplier Shenmao Technology received orders for ball-grid array (BGA) solder spheres from two connector customers earlier in March and will begin volume shipments in April, according to ...

The SM-BGA-9007 high-performance BGA socket has elastomer capable of high-speed, low-inductance, high-endurance, and wide-temperature applications. Designed for a 9.75 x 13-mm package size, it ...