SAN JOSE, CA--(Marketwire - Oct 15, 2012) - Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that TSMC has validated Cadence® 3D-IC ...

HSINCHU, Taiwan, R.O.C., Oct. 9, 2012 /PRNewswire/ -- TSMC (TWSE: 2330, NYSE: TSM) announced today that the readiness of 20nm and CoWoS™ design support within the Open Innovation Platform® (OIP) is ...

HSINCHU, Taiwan, R.O.C., Oct. 12, 2012 /PRNewswire/ -- TSMC (TWSE: 2330, NYSE: TSM) today announced that it has taped out the foundry segment's first CoWoS ™ (Chip on Wafer on Substrate) test vehicle ...

WILSONVILLE, Ore.--(BUSINESS WIRE)--Mentor Graphics Corp. (NASDAQ: MENT) today announced IC physical design, verification, thermal analysis and test design tools that have been selected for TSMC’s new ...

Amsterdam, The Netherlands: TSMC recently demonstrated two foundry-first reference flows that support 20nm and CoWoS (Chip on Wafer on Substrate) technologies. The 20nm reference flow enables 20nm ...

Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in 2025, driven by robust demand for cloud AI accelerators, according to ...

TSMC's 20nm Reference Flow enables double patterning technology (DPT) design using proven design flows. Leading EDA vendors' tools are qualified to work with TSMC 20nm process technology by ...

WILSONVILLE, Ore.--(BUSINESS WIRE)-- Mentor Graphics Corp. (NAS: MENT) today announced IC physical design, verification, thermal analysis and test design tools that have been selected for TSMC's new ...

This new generation of TSMC's CoWoS ™ test vehicles added a silicon proof point demonstrating the integration of a logic SoC chip and DRAM into a single module using the Wide I/O interface. TSMC's ...