TOKYO--(BUSINESS WIRE)--Furukawa Electric Co., Ltd. (TOKYO:5801) has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape ...
Increasing the yield of wafers is one way to attack the current global chip shortage. One possibility to reduce losses is a laser processing method called wafer stealth dicing. Here, laser power is ...
Huntersville, N.C., Jan. 04, 2023 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave ...
Chicago, Dec. 11, 2025 (GLOBE NEWSWIRE) -- The global wafer dicing services market was valued at US$ 617.5 million in 2025 and is projected to exceed valuation of US$ 932.9 million by 2035 at a CAGR ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback