For something as basic as thermal paste, people sure believe in a lot of myths about it. I mean, the role and impact of the ...

A new cooling technology could change how heat is managed in electronic devices—from tiny semiconductors to massive data ...

This so called thermal interface material (TIM) greatly reduces the contact resistance between the metal areas on the power semiconductor and the heat sink. On the EconoPACK+ of the new D Series, the ...

Yes, that is precisely what enthusiastic overclockers have been doing for years, delidding, or decapping (though the latter term is used less often in overclocking circles), chips through various DIY ...

Starting at the junction, heat conducts through the silicon and thermal interface material (TIM), then into a heat spreader before dissipating into the system cooling solution. However, the many ...

Liquid metal-based heat spreaders, heat sinks, and thermal interface materials can efficiently dissipate heat from high-power electronic devices and improve their performance and reliability. Liquid ...

Achieving Lower Voids with a Novel Preform Flux Technology, presented by Research Chemist David Bedner, and co-authored by Lee Kresge, Igor Faleichik, Dan McElhinney, and Dr. Ricky McDonough.