Abstract: This work provides a comprehensive overview of advanced integration-inspired memory process design, focusing on the integration methods of 2D, 2.5D, and 3D. The integration of compute and ...

Abstract: Among advanced packaging technology for heterogeneous chips, die-embedded packaging technology is expected for the minimization of packaging substrate thickness through integration of a ...

A somber morning greeted the workers at Advanced Process Technologies in Cokato, Minnesota, on November 11th, when an employee was found tragically deceased at her workstation. According to a post ...