Abstract: Dynamic thermal management (DTM) has been widely adopted to improve the energy efficiency, reliability, and performance of modern Multi-Processor SoCs (MPSoCs). However, the evolving ...
Abstract: In this article, the design and characterization of a 1200 V, 200 A rated printed circuit board (PCB) embedded silicon carbide (SiC) MOSFET half-bridge is being presented. The layout of the ...
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