RRP Electronics, US-based Deca Tech join hands for semiconductor packaging
Sachin Tendulkar-backed RRP Electronics partners with Deca Technologies to enhance semiconductor packaging capabilities and ...
Mother Jones5h
With Clean, Stable Power, Costa Rica Shapes Up as Taiwan’s Chipmaking Rival
Costa Rica generates nearly all its electricity from renewables. To boot, it’s the reliable 24/7 type that factories that run ...
US tariff on semiconductor chips: No major short-term impact on India, says IESA
The Indian Electronics and Semiconductor Association (IESA) has said that imposition of a 25% or higher tariff on ...
Trump’s latest tariff threat could make your life a lot more expensive
President Donald Trump is eyeing a “25% or higher” tariff across all semiconductor chips the United States imports, with ...
Asian News International on MSN3h
India, EU reiterate commitment for “human-centric, sustainable, responsible” AI; agree for cooperation on info exchange, language models
India and the European Union have reiterated their commitment to safe, secure, and sustainable Artificial Intelligence (AI) ...
Semiconductor Engineering9d
Advanced Packaging Evolution: Chiplet And Silicon Photonics-CPO
To achieve ExaFLOPS computing power, it requires at least 1,000 AI chiplets interconnected by advanced high-density RDL ...
Gov4d
Semiconductor industry continues to flourish and expand under PBBM administration
President Marcos Jr. also invited US semiconductor firms to establish wafer fabrication ... Image: Lilibeth Pagobo One of their hardworking employees is 53-years old Divina Bacus, an assembly line ...
The women who made America’s microchips and the children who paid for it
The US wants to bring back domestic chipmaking. But America’s first generation of Silicon Valley factory workers endured ...
BE Semiconductor: Increasing Price Target But Still 'Hold'
Explore the latest insights on BE Semiconductor Industries' performance, market trends, and future outlook. Find out why I ...
Digi Times21d
TSMC tightens restrictions on Chinese IC firms in line with US semiconductor controls
products using 16/14nm and below technologies must be packaged by a US Bureau of Industry and Security (BIS)-certified third-party OSAT (Outsourced Semiconductor Assembly and Test) provider.